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Sintered from high purity ultra-fine silicon carbide powder (sub-micron) in a vacuum furnace at the temperature of 2100°C – 2200°C. The sintering process will densify the green body. Direct Sintered SiC is better grade than Reaction Bonded SiC, and is commonly specified for high temperature work and hard-faced seal components. Pressureless sintering is the sintering of a powder compact (sometimes at very high temperatures, depending on the powder) without applied pressure. This avoids density variations in the final component, which occurs with more traditional hot-pressing methods.
| Properties | Unit of Measurement | Values |
| Purity (silicon) | % | >=98.5 |
| Density | g/cm3 | 3.12~3.15 |
| Hardness | HV | 2820 |
| Closed porosity | % | <2 |
| Compressive strength | MPa | >3000 |
| Young’s modulus | GPa | 400 |
| Transverse rupture strength | MPa | >390 |
| Coefficient of thermal expansion | 10-6/ok | 4 |
| Elastic modulus | GPa | >=410 |
| Thermal conductivity | W / m.ok | 110 |
| Mean specific heat | J/kg K | 1200 |
| Max. use temp | oC | 1750 |
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